BGW211EG

BGW211EG, low-power WLAN SiP, 2.5 GHz, 11 Mbps, 1.3 mm, HVQFN

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Price:: US $1.23~4.25 / piece [Get Latest Price]

Reference price:

Qty (lots)	Price/lot
100 ~ 500 :	4.25 / Piece
500 ~ 1000 :	2.12 / Piece
1000 ~ 1500 :	1.23 / Piece

PartNumber:: BGW211EG

Brand:: Philips Electronics India Limited - PHILIPS | Pack: HVQFN | D/C: 06+

Availability:: Supply Ability: 10000/Month Can Ship Immediately
Delivery: 10-15 Business Days (ships out within 3 Business days)

Quantity:: piece

Total Price:: US $0

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Products Upload time: 2013-06-25

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Part Number:BGW211EG
US $1.23 - 4.25
BGW211EG

US $3.00 - 4.00 / Piece
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Low-power WLAN SiP

US $0.10 - 100.00 / Piece
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Product Summary

The BGW211EG is one member of the BGW211 family which designed as the low-power WLAN SiP. It completes 802.11g functionality with the industrys lowest standby and operating power consumption and requires no external components for the total 802.11g solution.It can be used in smartphones, cellular phones, VoIP wireless phones; PDAs, handheld computing devices, WLAN adapter cards (secure digital); portable audio/video devices, MP3 players; and other handhelds and electronic devices for wireless digital, audio, multimedia, and telephony.

Parametrics

BGW211EG absolute maximum ratings: (1)frequency bands:2.4 to 2.5 GHz;(2)modulations:DBPSK, DQPSK, CCK (DSSS), OFDM;(3)data rates:1, 2, 5.5, 11 Mbps and 6, 9, 12, 18, 24, 36, 48, 54 Mbps;(4)receive power:300 mW (802.11b) and 400 mW (802.11g);(5)transmit power (15 dBm):550 mW (802.11b) and 600 mW (802.11g).

Features

BGW211EG features: (1)lowest-power consumption in standby (< 2 mW) and operating modes (PA, RF, baseband/MAC);(2)advanced, single-package WLAN 802.11g optimized for mobile handheld devices;(3)complete software drivers, utilities, and diagnostic tools;(4)No WLAN related processor load in all operating modes;(5)integrated ARM7 controller with associated memories;(6)optimized for real-time applications with minimal system power consumption;(7)no external components required;(8)low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm).